Thermal management system and method
US9408327B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2015 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Jul 15, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermally conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.