Solid-state drive with passive heat transfer
US9408328B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2012 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Nov 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10159
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.