Bonded abrasive tool and method of forming
US9409279B2 · kind B2 · utility
0Cited by
19References
17Claims
0Family size
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Key dates
| Filing date | Aug 21, 2013 |
| Grant date | Aug 9, 2016 |
| Priority date | — |
| Expiry date | Feb 21, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonded abrasive tool includes a bonded abrasive body having a bond matrix material with an organic bond material, abrasive grains contained within the bond matrix material, and chopped fiber bundles within the bond matrix material. The tool further has a porosity within the bonded abrasive body, wherein a majority of the porosity includes pores surrounding the chopped fiber bundles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.