Computer-implemented simulation method and non-transitory computer medium for use in molding process
US9409335B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2015 |
| Grant date | Aug 9, 2016 |
| Priority date | — |
| Expiry date | Sep 30, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2113/22
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A molding method includes the steps of specifying a simulating domain having a resin part and a mold part, wherein the simulating domain corresponds to a genuine domain on a molding machine; setting an initial resin temperature of the resin part and an initial mold temperature of the mold part; performing a transient state analysis to calculate a plurality of temperature distributions at different times between the resin part and the mold part; calculating at least one heat transfer coefficient between the resin part and the mold part taking into consideration the plurality of temperature distributions at different times; simulating the molding process of a molding resin that is injected into the simulating domain by using the at least one heat transfer coefficient to generate a plurality of molding conditions; and performing the molding process by using the plurality of molding conditions to the genuine domain on the molding machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.