Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board
US9410017B2 · kind B2 · utility
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17Claims
0Family size
Assignee
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Key dates
| Filing date | May 3, 2013 |
| Grant date | Aug 9, 2016 |
| Priority date | — |
| Expiry date | Dec 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0154
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a novel polyamic acid introduced with an imidazolyl group in the polymer chain, a photosensitive resin composition including the polyamic acid and that is capable of providing a photosensitive material that satisfies the characteristics of an excellent bending property and low stiffness and also exhibits excellent heat resistance and coating resistance, a dry film obtained from the photosensitive resin composition, and a circuit board including the dry film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.