Sputtering apparatus and method
US9410236B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2012 |
| Grant date | Aug 9, 2016 |
| Priority date | — |
| Expiry date | Jun 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32651
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A sputtering apparatus comprises a chamber configured to contain at least one sputter target and at least one substrate to be coated. The chamber has at least one adjustable shielding member defining an adjustable aperture. The member is positioned between the at least one sputter target and the at least one substrate. The aperture is adjustable in at least one of the group consisting of area and shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.