Electronic device assembly with compression gasket
US9411385B2 · kind B2 · utility
3Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2013 |
| Grant date | Aug 9, 2016 |
| Priority date | — |
| Expiry date | Jun 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0026
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An assembly (1000) includes a substrate (1002) and a heat emissive electrical component (1001) disposed on the substrate. A shield (1003) is disposed on the substrate, thereby enclosing the heat emissive electrical component. A display assembly (101) is disposed above the shield. A compressible pad (1004) is disposed between the shield and the display assembly. The compressible pad defines an aperture (1005) above the heat emissive electrical component. The aperture can have dimensions that are a function of a shield area and a heat emissive electrical component area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.