Module structure
US9412921B2 · kind B2 · utility
1Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2013 |
| Grant date | Aug 9, 2016 |
| Priority date | — |
| Expiry date | Jul 4, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a module structure including a front sheet, a back sheet, and an optoelectronic device disposed between the front sheet and the back sheet. A first packaging layer is disposed between the optoelectronic device and the front sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the optoelectronic device and the polyolefin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.