Pulsed line beam device processing systems using laser diodes
US9413137B2 · kind B2 · utility
6Cited by
4References
24Claims
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Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Aug 9, 2016 |
| Priority date | — |
| Expiry date | Mar 15, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C66/949
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Pulsed laser beams provided by laser diodes or arrays of laser diodes are applied to substrates such as amorphous silicon. The optical beam is based on a plurality of beams from respective laser diodes and is shaped, homogenized, and directed to a substrate. Duty cycles of the laser diodes are selected to be less than about 0.2. Exposures are applied to Aft an amorphous silicon layer on a rigid or flexible substrate to produce a polysilicon layer with a mobility of at least 50 cm2/Vs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.