Altering thermal conductivity in devices
US9414530B1 · kind B1 · utility
4Cited by
6References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2012 |
| Grant date | Aug 9, 2016 |
| Priority date | — |
| Expiry date | Nov 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20472
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Described are features to control distribution of thermal energy by structures such as portions of a case of a device. Various patterns of thermally conductive or insulating substances alter the thermal conductivity of a structure and provide selective directional distribution of thermal energy away from a hot spot caused by operation of a device component. The features result in a predetermined distribution of thermal energy across one or more structures, and may increase thermal uniformity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.