High temperature substrate attachment glass
US9415569B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2014 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Feb 16, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of bonding a first substrate to a second substrate includes providing a glass, applying the glass in a layer between the first and second substrates to form an assembly, and heating the assembly to a bonding temperature above a glass transition temperature of the devitrifying glass, selected to cause the glass to bond the first substrate to the second substrate. The devitrifying glass has constituents that include various amounts of group A in a molar concentration of 70-95%, group B in a molar concentration of 5-20%, group C in a molar concentration of 1-20%, group D in a molar concentration of 0-6%; and group E in a molar concentration of 0-10%. The group A, B, C, D and E groups are disclosed herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.