Photoresist composition
US9417526B2 · kind B2 · utility
1Cited by
18References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2014 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Dec 17, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/13625
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photoresist composition includes an acid-labile polymer that is decomposable by reaction with an acid, a photoacid generator, an organic base having a pKa value of 9 or less and a solvent. Based on 100 parts by weight of the acid-labile polymer, the photoacid generator is about 1 to about 30 parts by weight, and the organic base is about 0.1 to about 5 parts by weight. The solvent is about 50 to about 90 wt % based on the total weight of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.