Integrated circuit film and method for manipulating the same
US9418254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2013 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Dec 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/401
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit film comprising a circuit board and a control circuit is provided. The circuit board has an IC-installation part and a contact part and having a first surface and a second surface opposite to the first surface. The contact part comprises a first set of pads and a second set of pads. The first set of pads are located on the first surface for communicating with an electrical communication device. The second set of pads are located on the second surface for communicating with a smart card. The control circuit is mounted on the IC-installation part for communicating with the electrical communication device through one of the first set of pads configured in accordance with a single wire protocol (SWP), a communication protocol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.