Curable epoxy resin composition
US9418774B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2014 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Jul 14, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable epoxy resin composition including a defined aromatic epoxy resin component and a defined latent catalyst system, and optionally further additives, the curable composition being a single epoxy resin composition having a prolonged pot life at a processing temperature within the range of 40° C. to 70° C., wherein: (a) the epoxy resin component is a compound of formula (I) in monomeric form or in a low polymeric form thereof, or is a mixture of such compounds:the epoxy resin component having an inherent viscosity within the range of 80 mPas to 300 mPas, measured at a temperature of 50° C.; (b) the latent catalyst system includes at least one metal acetylacetonate and at least one phenolic compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.