Image pickup apparatus, semiconductor device, and electronic device including a buried portion disposed adjacent to a bonding portion, and method for manufacturing the same
US9419040B2 · kind B2 · utility
3Cited by
0References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 23, 2015 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Jan 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
Abstract
There is provided a solid state image pickup apparatus including a first semiconductor substrate and a second semiconductor substrate which are bonded to each other, and a buried portion formed in a peripheral portion of the apparatus with a depth of a bonded surface of the first semiconductor substrate and the second semiconductor substrate in such a manner that the bonded surface of the first semiconductor substrate and the second semiconductor substrate is not exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.