Potted optoelectronic module having a plurality of semiconductor components and method for producing an optoelectronic module
US9419190B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2010 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Apr 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic semiconductor component comprising: a main body (100) having a recess; (102), a first optoelectronic element (104) and a second optoelectronic element; (106) a surface structured element; (110) and a filling compound (112) embedding the first optoelectronic element (104) and the second optoelectronic element (106) in the recess, wherein the surface structured element configures a surface of the filling compound (112) such that at least two domed regions (114, 116, 118) of the surface are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.