Apparatus and methods related to conformal coating implemented with surface mount devices
US9419667B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2014 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Apr 14, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.