Substrate structure
US9420681B1 · kind B1 · utility
5Cited by
6References
9Claims
0Family size
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Key dates
| Filing date | Jun 18, 2015 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Jun 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate structure includes a substrate, a buffer layer, and a protecting layer. The substrate includes a side surface. The buffer layer is disposed between the side surface of the substrate and the protecting layer, and the hardness of the protecting layer is greater than the hardness of the buffer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.