Method for controlling warpage within electronic products and an electronic product
US9420694B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 31, 2010 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Oct 31, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a method for minimizing warpage in the electronic products, and the structures of such electronic products as well. Groove holes are formed into the insulating material layer or several layers. The groove holes can be processed by laser drilling or by other suitable means. A cured epoxy adhesive will fill the groove holes after the heat and pressure treatment performed to the circuit structure. The electronic product may contain several insulating layers and embedded electronic components connected to a wiring layer. A double-stacked symmetrical structure can also be manufactured. Asymmetrical structures with different sized embedded components can be handled as well. The groove holes can be shaped as straight short lines, ellipses, crosses, circles etc, or as any combination of different shapes. The groove holes can be scratched so that they locate outside strips, between the strips of a panel, between blocks of the strip, between modules of the block or between embedded components of the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.