Laser processing apparatus and laser processing method using the same technical field
US9421638B2 · kind B2 · utility
2Cited by
7References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 20, 2007 |
| Grant date | Aug 23, 2016 |
| Priority date | — |
| Expiry date | Sep 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/082
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus is provided in which its XY table is composed of plural divided blocks vertically movable, at least one divided block is stopped while it is moving down, and a through hole is formed by irradiating a workpiece in an area corresponding to a position directly above the divided block with a laser beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.