Substrates or assemblies having directly laser-fused frits, and/or method of making the same
US9422189B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 11, 2011 |
| Grant date | Aug 23, 2016 |
| Priority date | — |
| Expiry date | Oct 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24851
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Certain example embodiments relate to substrates or assemblies having laser-fused fits, and/or methods of making the same. In certain example embodiments, a pattern is formed or written on a stock glass sheet by laser fusing frit material to the glass sheet. An optional thin film coating is disposed on and supported by the stock glass sheet. The stock glass sheet with the pattern and the optional thin film coating is cut prior to heat treatment (e.g., heat strengthening and/or thermal tempering). A YAG or other type of laser source may be used to directly or indirectly heat the frit material, which may be wet applied to the substrate. In certain instances, the laser firing of the frit raises the temperature of the glass substrate to no more than 100 degrees C. and, preferably, the temperature is kept even lower.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.