Hard film for cutting tool
US9422627B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2013 |
| Grant date | Aug 23, 2016 |
| Priority date | — |
| Expiry date | Mar 18, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a hard film for a cutting tool formed on a surface of a base material, the hard film being comprised of a nano multi-layered structure formed by sequentially stacking a thin layer A, a thin layer B, a thin layer C and a thin layer D or being comprised of a structure formed by repeatedly stacking the nano multi-layered structure at least twice, wherein the thin layer A is comprised of TixAl1-xN (0.5≦x≦0.7); the thin layer B is comprised of Al1-y-zTiyMezN (0.4≦y≦0.7, 0<z≦0.1 where Me is at least one of Si, Cr, and Nb); the thin layer C is comprised of AlaTi1-aN (0.5≦a≦0.7); and the thin layer D is comprised of AlbCr1-bN (0.5≦b≦0.7).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.