Board-warping measuring apparatus and board-warping measuring method thereof
US9423242B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2015 |
| Grant date | Aug 23, 2016 |
| Priority date | — |
| Expiry date | Apr 23, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/306
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A board-warping measuring method is configured to measure a device under test. The device under test is disposed on a measuring carrier. The board-warping measuring method includes: projecting a pattern onto the device under test, wherein the pattern includes plural reference points; capturing a measurement image by an image-capturing module when the pattern is projected onto the device under test, wherein the measurement image includes plural measurement points respectively corresponding to the reference points; calculating a position of each of the measurement points in the measurement image by utilizing a transfer function corresponding to each of the reference points to obtain position heights of the device under test corresponding to the measurement points; and compensating for board warping of the device under test based on the position heights of the device under test corresponding to the measurement points.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.