Thermally conductive silicone adhesive composition for reactor and reactor
US9424977B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 2, 2014 |
| Grant date | Aug 23, 2016 |
| Priority date | — |
| Expiry date | May 2, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermally conductive silicone adhesive composition for a reactor, having good fluidity even when containing a large amount of thermally conductive filler to obtain a thermally conductive silicone adhesive composition, permitting potting of fine substrates, having good properties after curing, having little change in properties even with heat or moist-heat aging, and giving good adhesiveness to metals and organic resins, and a reactor potted by this composition, can be provided by making a thermally conductive silicone adhesive composition having a viscosity of 100 mPa·s at 25° C. and containing a liquid organohydrogenpolysiloxane having 2-10 hydrogen atoms bonded with silicon atoms in the molecule, containing no alkoxy groups, having at least one epoxy group bonded with a silicon atom via an alkylene group, having a polysiloxane degree of polymerization of 15 or lower, and containing a polysiloxane skeleton having a cyclic structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.