Patent · US Active

Electronic component having a corrosion-protected bonding connection and method for producing the component

US9425118B2 · kind B2 · utility

0Cited by

1References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Fabian Bez · Reutlingen, DE
Johannes Duerr · Reutlingen, DE
Rolf Becker · Rheydt, DE
Sven Lamers · Reutlingen, DE
Lutz Mueller · Altadena, US
Michael Schlecht · Esslingen am Neckar, DE

Key dates

Filing date	Nov 29, 2012
Grant date	Aug 23, 2016
Priority date	—
Expiry date	Nov 29, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to an electronic component (1) having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component (1) has at least one semiconductor chip (3) on a substrate (4). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip (3). For encapsulation of the at least one semiconductor chip (3) and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing (5). The hermetically sealed bonding connection is a bonding wire connection (2) which is fully enclosed in the housing (5), in which the substrate (4) is at least partially enclosed. The substrate (4) has at least one surface-mounted hydrolysis-sensitive component (6) in the housing (5).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.