Compliant electrostatic transfer head with spring support layer
US9425151B2 · kind B2 · utility
32Cited by
61References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2014 |
| Grant date | Aug 23, 2016 |
| Priority date | — |
| Expiry date | Jun 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/95
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.