Patent · US Active

Rigid-flex module and manufacturing method

US9425158B2 · kind B2 · utility

0Cited by

2References

10Claims

0Family size

Assignee

GE Embedded Electronics Oy · FI

Inventors

Antti Iihola · Helsinki, FI
Tuomas Waris · Helsinki, FI

Key dates

Filing date	Jan 5, 2010
Grant date	Aug 23, 2016
Priority date	—
Expiry date	Mar 14, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/308
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane (20) and a sacrificial-material piece (16) are attached to an insulator membrane (12) in the location of the flexible zone (13). An insulator layer (1), which encloses within itself a sacrificial-material piece (16) is manufactured on the surface of the conductor membrane (12). The flexible zone (13) is formed in such a way that an opening (9) is made in the insulator layer (1), through which the sacrificial-material piece (16) is removed. The flexible zone comprises at least part of the flexible membrane (20) as well as conductors (22), which are manufactured by patterning the insulator membrane (12) at a suitable stage in the method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.