LED device, method of manufacturing the same, and light-emitting apparatus
US9425372B2 · kind B2 · utility
1Cited by
8References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 18, 2011 |
| Grant date | Aug 23, 2016 |
| Priority date | — |
| Expiry date | Aug 1, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The LED device (27) has a LED bare chip (25) mounted directly on a metal contact (28), and supplies power to the bare chip and conducts heat from the bare chip via the metal contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.