Interposer assembly and method
US9425525B2 · kind B2 · utility
15Cited by
13References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2015 |
| Grant date | Aug 23, 2016 |
| Priority date | — |
| Expiry date | Sep 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/2435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The application discloses an improved interposer assembly with a molded plastic plate and stamp-formed metal contacts inserted in through passages in the plate. The contacts have redundant separate metal circuit paths extending between opposed contact points to reduce inductance and contact resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.