Low profile, highly configurable, current sharing paralleled wide band gap power device power module
US9426883B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2015 |
| Grant date | Aug 23, 2016 |
| Priority date | — |
| Expiry date | Jan 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.