Welding method for substrate and membrane of membrane mobile polymer microfluidic chip
US9427735B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 29, 2012 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Nov 6, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/036
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention discloses a welding method for substrate and membrane of membrane mobile polymer microfluidic chip, which relates to the manufacturing technology of membrane mobile polymer microfluidic chip and comprises the following steps: before the welding, the substrate is fixed, the surface of the substrate is covered with the membrane; the membrane is pressed against the surface of the substrate, and in the course of welding, the laser irradiates the welding area on the substrate through the membrane, and the welding area fuses and then welds the substrate and membrane together. The present invention realizes the firm welding between membrane and substrate of membrane mobile polymer microfluidic chip, and ensures that the weld face is flat and uniform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.