Apparatus and method for laser cutting with a laser implementing gas pulses, the frequency or pressure of which is controlled
US9427823B2 · kind B2 · utility
5Cited by
6References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 11, 2012 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Sep 16, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The head (9) of the cutting apparatus (4) of the laser comprises a gas supply through a device such as a barrel dispenser which chops the blowing flow rate, which produces a better discharge of the liquid slag melt by the laser beam (16, 18) out of the plate (19) to be cut. A measurement (36) of backscattered light is made in order to check the good quality of cutting, the amount measured being smaller if the cutting actually passes through the plate (19), and the frequency or the pressure of the blowing pulses is adjusted by a controlling device (39) to keep the measure to a minimum by optimizing the slag discharge conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.