Method of introducing a structure in a substrate
US9427885B2 · kind B2 · utility
1Cited by
12References
54Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2009 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Nov 29, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24273
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention relates to methods for the production of micro-structured substrates and their application in natural sciences and technology, in particular in semiconductor, microfluidic and analysis devices. It concerns a method of introducing a structure, such as a hole or cavity or channel or well or recess or a structural change by providing a controlled electrical discharge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.