Patent · US Active

Method of introducing a structure in a substrate

US9427885B2 · kind B2 · utility

1Cited by
12References
54Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 2, 2009
Grant dateAug 30, 2016
Priority date
Expiry dateNov 29, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24273
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

This invention relates to methods for the production of micro-structured substrates and their application in natural sciences and technology, in particular in semiconductor, microfluidic and analysis devices. It concerns a method of introducing a structure, such as a hole or cavity or channel or well or recess or a structural change by providing a controlled electrical discharge.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.