System and method for forming a bonded joint
US9427911B1 · kind B1 · utility
3Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2013 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Feb 18, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3085
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for forming a bonded joint on a composite structure is presented. An apparatus carrying a first workpiece is positioned relative to a second workpiece. A vacuum is applied to the first workpiece and a portion of the second workpiece. A bladder on a first surface of a housing of the apparatus is deflated. Deflating the bladder positions the first workpiece such that adhesive having a desired thickness is positioned between the first workpiece and the second workpiece. The adhesive positioned between the first workpiece and the second workpiece is cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.