Transfer lamination
US9427944B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 27, 2013 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Mar 27, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09F3/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of laminating a transfer section of a transfer layer to a substrate is performed using a reverse-image transfer printing device. The device includes a transfer ribbon, a print ribbon, a print head, and a laminating device. The transfer ribbon comprises the transfer layer, which is attached to a carrier layer. The print head is configured to transfer print material from the print ribbon to the transfer layer. Non-transfer portions of the transfer section are heated to a deactivation temperature using the print head. The transfer section is laminated to the substrate by heating the non-transfer portions and transfer portions of the transfer section using the laminating device. This bonds the transfer portions the substrate. The carrier layer is the removed from the transfer portions leaving the transfer portions bonded to the substrate. The non-transfer portions remain attached to the carrier layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.