Polyfunctional epoxy compound
US9428606B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2011 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Feb 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is provided an epoxy resin composition having low viscosity and a high cationic curing property. An epoxy compound of Formula (1):(in Formula (1), A is an (n4)-valent C4-20 linear hydrocarbon group optionally containing an epoxy group, an (n4)-valent C4-20 cyclic hydrocarbon group optionally containing an epoxy group, or an (n4)-valent group of a combination of the linear hydrocarbon group and the cyclic hydrocarbon group; R1 and R2 are each independently a hydrogen atom or a C1-10 alkyl group; n1 is an integer of 2 to 6; n2 is an integer of 2; n3 is an integer of 1; and n4 is an integer of 3 to 8). For example, A is an (n4)-valent organic group formed by removing (n4) hydrogen atoms from butane, pentane, or hexane, or an (n4)-valent organic group formed by removing (n4) hydrogen atoms from cyclobutane, cyclopentane, cyclohexane, epoxycyclohexane, alkyl-substituted epoxycyclohexane, bicycloheptene, or bicyclooctene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.