Heat sink with flat heat pipe
US9429370B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2014 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Nov 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4006
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink apparatus is disclosed. The apparatus comprises a base unit for use with an electronic component operable to make contact with a heat generating source, wherein the heat generating source is affixed to a printed circuit board. It also comprises a top unit wherein the top unit of the heat sink is rotatively coupled to the base unit, and wherein a slot forms in between the top unit and the base unit when the top unit is coupled to the base unit. Finally it comprises a heat pipe, wherein the heat pipe is received through the slot and held tightly therein, and wherein the heat pipe is operable to dissipate heat transferred through the base unit away from the heat generating source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.