Wafer level packaged optical subassembly and transceiver module having same
US9429727B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2014 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Nov 6, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/425
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.