Chemical sensor package for highly pressured environment
US9431315B2 · kind B2 · utility
1Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2014 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Dec 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A package for a chemical sensor including an encapsulation and a pressure balancing structure is disclosed. The encapsulation encapsulates a chemical sensor and has a hole for exposing a chemical sensitive part of the chemical sensor. The pressure balancing structure balances pressure applied to the chemical sensor at the chemical sensitive part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.