Wiring board and method for manufacturing the same
US9431347B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2014 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Jul 20, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and having a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and form a distance between adjacent first and third mounting pads which is greater than a distance between adjacent first mounting pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.