Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure
US9431373B2 · kind B2 · utility
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2References
16Claims
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Key dates
| Filing date | Dec 16, 2014 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Jan 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D88/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional integrated structure may include two assembled integrated circuits respectively including two metallic lines, and at least two cavities passing through one of the integrated circuits and opening onto two locations respectively in electrical contact with the two metallic lines. The cavities may be sized to place a measuring apparatus at the bottom of the cavities, and in electrical contact with the two locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.