LED package with reflecting cup

US9431591B1 · kind B1 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• HOU-TE LIN · Hsinchu, TW
• PIN-CHUAN CHEN · Hsinchu, TW
• LUNG-HSIN CHEN · Hsinchu, TW
• Wen-Liang Tseng · Hsinchu, TW

Key dates

• Filing date: Aug 13, 2015
• Grant date: Aug 30, 2016
• Expiry date: Aug 13, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8506

Abstract

The present disclosure provides a light emitting diode package which includes a plurality of electrodes, an LED die, a reflecting cup, and a phosphor layer. The LED die are electrically connected with the electrodes. The LED die includes a top light emitting surface and a plurality of lateral sides extending downward from the top light emitting surface. The reflecting cup is formed on the electrodes and surrounds the LED die. The reflecting cup includes an inner surface. The inner surface contacts with bottom portion of the LED die. A cavity is defined between the inner surface and other portion except the bottom portion of the LED die. The phosphor layer covers and seals the LED die.