Submount with cavities and through vias for LED packaging
US9431592B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2012 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Aug 17, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer having a plurality of light-emitting diode (LED) submounts and a method for fabricating an LED submount are provided. Each of the plurality of LED submounts of the wafer includes: a substrate (201), including through vias (203a); an LED die (208) mounted in a cavity (204) on a first side of the substrate (201) and connected to the through vias (203a); a redistribution layer (205a) attached to a second side of the substrate (201) connected to the LED die (208) through the through vias (203a). The method includes providing a wafer as a substrate (201); providing a cavity (204) in the substrate (201) on a first side of the substrate (201); providing through vias (203a) in the substrate (201), providing a redistribution layer (205a) on the second side of the substrate (201), and mounting an LED (208) in the cavity (204), wherein the LED die (208) is connected to the redistribution layer (205a) through the through vias (203a).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.