Patent · US Active

Method of coupling a feedthrough assembly for an implantable medical device

US9431801B2 · kind B2 · utility

5Cited by

111References

17Claims

0Family size

Assignee

HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

Jacob Markham · Vadnais Heights, US
Ulrich Hausch · Frankfurt, DE
Goran Pavlovic · Schaafheim, DE

Key dates

Filing date	May 24, 2013
Grant date	Aug 30, 2016
Priority date	—
Expiry date	Jul 18, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49213
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

One aspect is a method of coupling a feedthrough assembly to a surrounding case of an implantable medical device. An insulator having a plurality of conducting elements extending therethrough is provided. The insulator is placed with conducting elements within an opening of a case, thereby defining a narrow space between the insulator and the case. A braze preform is placed adjacent the insulator and case in the narrow space. The insulator is heated with a laser until raising the temperature of the adjacent preform above its melting point such that it fills the space between the insulator and the case.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.