Differential signal crosstalk minimization for dual stripline
US9433081B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2014 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Aug 20, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D30/00
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
The subject technology provides configurations for a printed circuit board that includes a first reference plane, a first signal layer below the first reference plane, a second signal layer below the first signal layer, a second reference plane below the second signal layer, a first differential pair on the first signal layer, and a second differential pair on the second signal layer, each of the first and second differential pairs comprising, respectively, a first pair and a second pair of conductive traces formed on a dielectric material of the PCB, the first pair of conductive traces being arranged on the dielectric material to interleave with the second pair of conductive traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.