Edge plated printed circuit board
US9433090B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2014 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Apr 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09354
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An edge plated printed circuit board (PCB) improves radiated emission performance by enhancing ground shielding on the PCB and improving the physical and electrical connection between the PCB and external EMI suppression components including an EMI chassis and gaskets. Inner ground layers within a multi-layer PCB are configured to physically extend to an edge of the PCB, which is plated using copper electroplating, so that copper ground strips disposed at the top and bottom surfaces of the PCB and the inner ground layers are all electrically coupled to the plated edge. In some embodiments, the ground strips can be made thinner compared to conventional arrangements, or be eliminated altogether as a result of the direct connection between the edge plated PCB and external EMI shields.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.