Pb-free copper-alloy sliding material, and plain bearing
US9434005B2 · kind B2 · utility
1Cited by
5References
9Claims
0Family size
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Key dates
| Filing date | Jun 11, 2012 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | May 26, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/86
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of producing a Pb-free copper-alloy sliding material containing 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, 0.5 to 30.0% of Zn, and 1.0 to 10.0 mass % of at least one of a group consisting of Fe3P, Fe2P, FeB, NiB and AlN may be added.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.