Environmental engineered wood laminate flooring manufacturing method
US9434147B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 1, 2011 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Jul 1, 2031 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F15/102
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
An environmental engineered wood laminate flooring manufacturing method comprising the following: using a wood veneer layer as the top layer, adhering on the wood veneer layer a wear layer, and pressing on the bottom surface of the wood veneer layer a layer of glue-soaked paper, so as to accentuate the clear and natural wood lines on the wood veneer layer; using a high density board as a base board layer, and adhering on the bottom surface thereof a balancing layer; stacking the wood veneer layer, the wear layer, the glue-soaked paper, the base board layer, and the balancing layer; heat pressing with a heat press at a temperature between 170 and 190° C., at a pressure between 16 and 22 Mpa, and for 20 to 50 s. Corresponding tongues and grooves are provided on the four lateral faces of the manufactured flooring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.