Cover glass and method for producing cover glass
US9434644B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 28, 2011 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Nov 29, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C15/02
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The disclosed cover glass is produced by etching a glass substrate that has been formed by a down-drawing process, and chemically strengthening the glass substrate to provide the glass substrate with a compressive-stress layer on the principal surfaces thereof. The glass substrate contains, as components thereof, 50% to 70% by mass of SiO2, 5% to 20% by mass of Al2O3, 6% to 30% by mass of Na2O, and 0% to less than 8% by mass of Li2O. The glass substrate may also contain 0% to 2.6% by mass of CaO, if necessary. The glass substrate has an etching characteristic in which the etching rate is at least 3.7 μm/minute in an etching environment having a temperature of 22° C. and containing hydrogen fluoride with a concentration of 10% by mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.