Bisphenol A (BPA) free epoxy resins
US9434867B2 · kind B2 · utility
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4References
13Claims
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Assignee
Inventor
Key dates
| Filing date | Sep 21, 2015 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Sep 21, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/17
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin is provided that includes a diglycidyl ether of a substituted cycloaliphatic diol or bis-thiol, and a thermoset epoxy polymer is provided employing the same. The epoxy resin is bisphenol A free, and capable of forming thermoset epoxy polymers with fewer associated health and environmental concerns than conventional epoxies based on phenolic compounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.